A study on thermophysical properties of printed wick structures and their applications in ultrathin devices
Author:
Funder
National Science Fund for Distinguished Young Scholars
Publisher
Elsevier BV
Subject
General Engineering
Reference29 articles.
1. Heat pipe science and technology;Faghri;Fuel Energy Abstr.,1995
2. Thermal performance enhancement of an ultrathin flattened heat pipe with multiple wick structure;Tang;Appl. Therm. Eng.,2021
3. A novel vapor chamber and its performance;Wong;Int. J. Heat Mass Tran.,2010
4. Experimental investigation on the vapor chambers with sintered copper powder wick;Huang;J. Therm. Sci.,2020
5. A novel ultrathin vapor chamber for heat dissipation in ultrathin portable electronic devices;Huang;Appl. Therm. Eng.,2020
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Evaluation on capillary performance of multifunctional ultra-thin composite wick;Thermal Science and Engineering Progress;2024-06
2. Design and Fabrication of a Large Area Ultrathin Vapor Chamber Based on Print-Wick-Structuring Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05
3. Evaluation on Capillary Performance of Multifunctional Ultra-Thin Composite Wick;2023
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