Shakedown and creep rupture analysis of printed circuit heat exchangers based on the linear matching method framework-Reference-Cited by-同舟云学术

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Shakedown and creep rupture analysis of printed circuit heat exchangers based on the linear matching method framework

Published:2024-06 Issue: Volume:233 Page:104127
ISSN:0168-874X
Container-title:Finite Elements in Analysis and Design
language:en
Short-container-title:Finite Elements in Analysis and Design

Author:

Ma Zhiyuan,Fu Zhuojia,Chen Haofeng,Wang Xiaoxiao

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference33 articles.

1. High-Temperature Test of 800HT Printed Circuit Heat Exchanger in HELP;Kim,2014

2. A flexible tool for modeling thermal loading in printed Circuit heat exchangers;Jentz,2019

3. Linear matching method for creep rupture assessment;Chen;Int. J. Pres. Ves. Pip.,2003

4. R5: Assessment Procedure for the High Temperature Response of Structures;Ainsworth,2003

5. Creep rupture limit analysis for engineering structures under high-temperature conditions;Wang;Int. J. Pres. Ves. Pip.,2022

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