1. J. Sommer, R. Dudek, E. Kaulfersch, A. Schubert, B. Michel, Thermal–mechanical FE analysis and micro deformation measurements—basis for reliability assessment of microelectronic components, in: ITHERM ’98, The Sixth Intersociety Conference on Thermal Phenomena, Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, WA, 1998, pp. 159–165.
2. G. Gustafsson, I. Guven, V. Kradinov, E. Madenci, Finite element modeling of BGA packages for life prediction, in: Proceedings of the 50th Electronic Components and Technology Conference, 2000, Las Vegas, NV, 2000, pp. 1059–1063.
3. T.Y. Tee, K. Sivakumar, D.B.V. Antonio, Board level solder joint reliability modeling of LFBGA package, in: Electronic Materials and Packaging (EMAP 2000), International Symposium on Electronic Materials & Packaging, Hong Kong, China, 2000, pp. 51–54.
4. L. Zhang, S.S. Chee, A. Maheshwari, A. Funcell, Experimental and finite element analysis of cavity down BGA package solder joint reliability, in: Proceedings of Third Electronics Packaging Technology Conference (EPTC 2000), Singapore, 2000, pp. 391–397.
5. A nested finite element methodology (NFEM) for stress analysis of electronic products—part I;Darbha;ASME J. Electron. Packag.,2001