Author:
Furu T.,Shercliff H.R.,Baxter G.J.,Sellars C.M.
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Relationship between room-temperature proof stress, dislocation density and subgrain size
2. Effect of changing strain rate on stress-strain behaviour during high temperature deformation
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4. Humphreys, F. J. and Hatherly, M., Recrystallisation and Related Annealing Phenomena. Elsevier Science, Oxford, 1996
5. Bolingbroke, R. K., Creed, E., Marshall, G. J. and Ricks, R. A., in Proc. Conf. “Aluminium Alloys for Packaging”, ed. J. G. Morris et al., 1993, p. 215
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