Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture-Reference-Cited by-同舟云学术

Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture

Published:1999-10 Issue:14 Volume:47 Page:3869-3878
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Zhang T.-Y,Chen L.-Q,Fu R

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference40 articles.

1. Thin Films: Stresses and Mechanical Properties I, II, III, IV, V, VI and VII, MRS Proceedings, Vol. 130, 1988; Vol. 188, 1990; Vol. 239, 1991; Vol. 308, 1993; Vol. 356, 1994; Vol. 436, 1996; and Vol. 505, 1997.

2. Residual Stresses;Noyan,1985

3. Handbook of Measurement of Residual Stresses,1996

4. Optical fluorescence from chromium ions in sapphire: A probe of the image stress

5. Measurements of residual stresses in thin films using micro-rotating-structures

Cited by 67 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage;Journal of Electronic Packaging;2023-11-23

2. Residual stress measurement of build-up layer in silicon wafers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Nanoheterogeneous ZrTa metallic glass thin films with high strength and toughness;Journal of Alloys and Compounds;2022-04

4. Surface texture of substrates prepared by femtosecond laser for improving the thermal cycle life of TBCs;Ceramics International;2022-02

5. Simple and Versatile Analytical Method for Monitoring the Deposition of Thin Layers by Optical Measurement and Calculation of Residual Stress;Thin Solid Films;2021-05