Scaling of the spacing of deformation induced dislocation boundaries
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700°C
2. A compilation and analysis of data for the stress dependence of the subgrain size
3. Dislocation substructures formed during the flow stress recovery of high purity aluminum
4. Geometrically necessary boundaries and incidental dislocation boundaries formed during cold deformation
5. Deformation microstructure and orientation of f.c.c. crystals
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