The effect of matrix microstructure and reinforcement shape on the creep deformation of near-γ titanium aluminide composites-Reference-Cited by-同舟云学术

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The effect of matrix microstructure and reinforcement shape on the creep deformation of near-γ titanium aluminide composites

Published:1998-05 Issue:8 Volume:46 Page:2881-2894
ISSN:1359-6454
Container-title:Acta Materialia
language:en
Short-container-title:Acta Materialia

Author:

Kampe S.L.,Christodoulou J.,Feng C.R.,Christodoulou L.,Michel D.J.

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference42 articles.

1. Particulate reinforced metal matrix composites — a review

2. Room-Temperature strength and deformation of Tib2-reinforced near-γ titanium aluminides

3. Progress Report on Recent Advances in Physical Metallurgy: (C) The Quantitative Relationship between Microstructure and Properties in Two-Phase Alloys

4. Rosler, J., Valencia, J. J., Levi, C. G., Evans, A. G. and Mehrabian, R., in Intermetallic Matrix Composites (conf. proc.), MRS Vol. 194. Materials Research Society, Pittsburgh, 1990, pp. 241–248

5. Clyne, T. W. and Withers, P. J., An Introduction to Metal Matrix Composites. Cambridge University Press, Cambridge, U.K., 1993, p. 130

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1. Microstructures and mechanical properties of TiC-particulate-reinforced Ti–Mo–Al intermetallic matrix composites;Materials Science and Engineering: A;2020-07

2. High temperature deformation behaviour and microstructure of cast in-situ TiAl matrix composite reinforced with carbide particles;Journal of Alloys and Compounds;2019-08

3. Shape-Controlled TiCx Particles Fabricated by Combustion Synthesis in the Cu-Ti-C System;Crystals;2017-07-06

4. Compression Properties and Electrical Conductivity of In-Situ 20 vol.% Nano-Sized TiCx/Cu Composites with Different Particle Size and Morphology;Materials;2017-05-04

5. Effect of stoichiometry on the surface energies of {100} and {111} and the crystal shape of TiCx and TiNx;CrystEngComm;2013

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