Thermal expansion of particle-filled plastic encapsulant: a micromechanical characterization
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference33 articles.
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4. Konsowski, S. G. and Helland, A. R., Electronic Packaging of High Speed Circuitry. McGraw-Hill, New York, 1997, Chapter 3
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