A kinetic model for the dissolution mechanism of copper in acidic sulfate solutions
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference42 articles.
1. Cathodic corrosion of Cu in H2SO4
2. Photoeffect on a Cu anode during electropolishing
3. Dichromate as inhibitor for the corrosion of Cu in HCl
4. Electrochemical studies on the corrosion of copper in organic electrolyte solutions
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