Electrode shape change during deposition onto an array of parallel strips-Reference-Cited by-同舟云学术

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Electrode shape change during deposition onto an array of parallel strips

Published:1983-10 Issue:10 Volume:28 Page:1309-1313
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Alkire Richard C.,Reiser David B.

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference17 articles.

1. Electrodeposition of disperse non-dendritic zinc on foreign substrates

2. Transport-Controlled Deposition and Dissolution of Metals;Despic,1972

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Damascene Copper Electroplating;Handbook of Semiconductor Manufacturing Technology, Second Edition;2007-07-09

2. The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition;Journal of The Electrochemical Society;1992-01-01

3. Computation of current distribution in electrodeposition, a review;IBM Journal of Research and Development;1990-09

4. A Review of Corrosion Failure Mechanisms during Accelerated Tests: Electrolytic Metal Migration;Journal of The Electrochemical Society;1987-01-01

5. Effect of Fluid Flow on Removal of Dissolution Products from Small Cavities;Journal of The Electrochemical Society;1984-12-01

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