The formation of anodic layers on annealed copper surfaces in phosphate-containing solutions at different pH
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference31 articles.
1. The influence of solution flow on anodic polishing. Copper in aqueous o-phosphoric acid
2. Solid Films on Electropolishing Anodes
3. Etude des phenomenes aux electrodes au cours du polissage anodique du cuivre dans l'acide phosphorique
4. Oscillations de potentiel au cours du polissage electrolytique d'une anode de cuivre dans l'acide orthophosphorique—I. Oscillations libres
5. Oscillations de potentiel au cours du polissage electrolytique d'une anode de cuivre dans l'acide orthophosphorique—II. Oscillations forcées
Cited by 46 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrocatalysis of the Oxygen Reduction Reaction by Copper Complexes with Tetradentate Tripodal Ligands;Inorganic Chemistry;2023-10-25
2. Effects of dissolved gases on partial anodic passivation phenomena at copper microelectrodes immersed in aqueous NaCl;Journal of Electroanalytical Chemistry;2020-09
3. Facile Electrochemical Method to Improve Surface Features of Pure Copper in Dilute Basic Solutions;Journal of Materials Engineering and Performance;2017-03-13
4. Electrochemical Behavior of Nano-grained Pure Copper in Dilute Alkaline Solution with Chloride Ion Trace;Journal of Materials Engineering and Performance;2016-08-31
5. Enhancing the Electrochemical Behavior of Pure Copper by Cyclic Potentiodynamic Passivation: A Comparison between Coarse- and Nano-Grained Pure Copper;Metallurgical and Materials Transactions B;2016-07-25
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3