A rotating ring-disc study of the influence of thiourea on the electrodeposition of copper from acid sulphate solutions
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference6 articles.
1. The Role of Intermediate (Cu+) in the Electrodeposition of Copper from an Acid Copper Sulfate Bath under the Pulsed Current Electrolysis
2. A rotating ring—disk study of dissolved Cu(I) at the Cu/Cu(II) electrode in sulphate media
3. Polarographic studies on the effect of thiourea on deposition of copper in the presence of 2M H2SO4
4. A Raman spectroscopic study of thiourea adsorbed on silver and copper electrodes
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1. Electrochemical codeposition of copper‑antimony and interactions with electrolyte additives: Towards the use of electronic waste for sustainable copper electrometallurgy;Hydrometallurgy;2022-05
2. Effects of Thiourea and Allyl Thioura on the Electrodeposition and Microstructures of Copper from Methanesulfonic Acid Baths;Journal of The Electrochemical Society;2021-03-01
3. Copper deposition and dissolution in mixed chloride–sulphate acidic electrolytes: cyclic voltammetry at static disc electrode;Transactions of the IMF;2015-03
4. Aspects of copper electrodeposition from acidic sulphate solutions in presence of thiourea;Transactions of the IMF;2006-01
5. Voltammetric and morphological characterization of copper electrodeposition from non-cyanide electrolyte;Journal of Applied Electrochemistry;2002
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