Periodic patterns and energy states of buckled films on compliant substrates
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Reference25 articles.
1. Analysis and Design of Sandwich Panels;Allen,1969
2. Buckling of a thin film bound to a compliant substrate—Part I: formulation, linear stability of cylindrical patterns, secondary bifurcations;Audoly;J. Mech. Phys. Solids,2008
3. Buckling of a thin film bound to a compliant substrate—Part II: a global scenario for the formation of herringbone pattern;Audoly;J. Mech. Phys. Solids,2008
4. Buckling of a thin film bound to a compliant substrate—Part III: herringbone solutions at large buckling parameter;Audoly;J. Mech. Phys. Solids,2008
5. Mechanics of Incremental Deformation;Biot,1965
Cited by 276 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Differential growth-induced center waving of film-substrate system;Mechanics of Advanced Materials and Structures;2024-09-08
2. Advancements in Novel Mechano-Rheological Probes for Studying Glassy Dynamics in Nanoconfined Thin Polymer Films;ACS Polymers Au;2024-07-18
3. Homogenization of nonlinear Cosserat plate including growth theory when the thickness of the plate and the size of the in-plane heterogeneities are of the same order of magnitude;Mathematics and Mechanics of Solids;2024-05-13
4. Wrinkle, fold, and ridge patterns of thin films attached to a compliant substrate: Direct numerical simulations involving plastic yielding;Thin-Walled Structures;2024-05
5. Negative Gaussian curvature regulated pattern evolution on curved bilayer system;International Journal of Mechanical Sciences;2024-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3