The reliability of encapsulated and unencapsulated thick-film hybrid microcircuits-Reference-Cited by-同舟云学术

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The reliability of encapsulated and unencapsulated thick-film hybrid microcircuits

Published:1986-07 Issue:4 Volume:17 Page:35-48
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Sutherland R.R.

Publisher

Elsevier BV

Subject

General Engineering

Reference16 articles.

1. Accelerated Life Testing of Small-Geometry Printed Circuit Boards;Sutherland;Circuit World,1985

2. Accelerated Life Testing of Small-Geometry Printed Circuit Boards;Sutherland;Printed Circuit Fabrication,1985

3. British Telecommunications Technology Executive, “Specification D4500C. Generic Specification for Thick Film Microcircuits”.

4. Silver Migration in Thick Film Conductors and Chip Attachment Resins;Coleman;Microelectronics Journal,1981

5. An Initial Reliability Assessment of Low Cost Plastic Encapsulated Hybrid Microcircuits;Tillman,1981

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physicochemical investigations and nonstandard electrical measurements of inks and thick films—Bibliography;Microelectronics Reliability;1991-01

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