Particle size analysis techniques for metal powders and frits used in thick-film pastes-Reference-Cited by-同舟云学术

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Particle size analysis techniques for metal powders and frits used in thick-film pastes

Published:1982-09 Issue:5 Volume:13 Page:16-24
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Anjard R.P.

Publisher

Elsevier BV

Subject

General Engineering

Reference44 articles.

1. Factors Influencing the Quality of Solder Powder Used for the Hybrid Microelectronics Industry;Anjard;Nepcon West,1982

2. Rheology and Viscometers of Microelectronics;Anjard;Microelectronics,1971

3. Leaching during Solder Immersion — Thick-Film Conductors;Anjard;Nepcon West,1970

4. Ceramic Substrate Strength Testing;Anjard;Solid-State Technology,1974

5. Thick-Film Conductor Adhesion Testing;Anjard;Microelectronics and Reliability,1971

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