Sub-surface feature location and identification using inverse TLM techniques
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference13 articles.
1. A simple explicit and unconditionally stable numerical routine for the solution of the diffusion equation;Johns;Int. J. Numer. Meth. Eng.,1977
2. 3D-TLM modelling of the thermal behaviour of conducting films on insulating substrates;de Cogan;J. Phys. D. (Appl. Phys.),1987
3. Thermal effects in thin conducting films on silica and alumina under near adiabatic, conditions;de Cogan;J. Phys. D. (Appl. Phys.),1987
4. A transient thermal failure mode in metal film resistors;Vardigans;J. Phys. D. (Appl. Phys.),1987
5. TLM modelling of solder voids in power semiconductors;de Cogan,1987
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