Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices-Reference-Cited by-同舟云学术

Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices

Author:

Hanreich G,Nicolics J,Stangl G

Publisher

Elsevier BV

Subject

General Engineering

Reference12 articles.

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2. Rework of flip-chip populated PCBs by laser desoldering;24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)