Modeling and characterization of deep trench isolation structures
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference11 articles.
1. C. Davis, G. Bajor, J. Butler, T. Crandell, J. Delgado, T. Jung, Y. Khajeh-Noori, B. Lomenick, V. Milam, H. Nicolay, S. Richmond, T. Rivoli, UHF-1: a high speed complementary bipolar analog process on SOI, Proceedings of the BIPOLAR/BiCMOS Circuits and Technology Meeting, 1992, pp. 260–263.
2. R.C. Jerome, I.R.C. Post, P.G. Travnicek, G.M. Wodek, K.E. Huffstater, D.R. Williams, Acute: a high performance analog complementary polysilicon emitter bipolar technology utilizing SOI/trench full dielectric isolation, IEEE International SOI Conference, 1993, pp. 100–101.
3. R. Patel, W. Milam, G. Cooley, M. Corsi, J. Erdeljac, L. Hutter, 30V complementary bipolar technology on SOI for high speed precision analog circuits, Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting, 1997, pp. 48–50.
4. J. McGregor, W. Yindepool, J. DeSantis, K. Brown, R. Bashir, W. McKeown, A 170V polycrystalline silicon-emitter complementary bipolar IC technology with full dielectric isolation, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, October 1997, pp. 183–186.
5. Back gated buried oxide MOSFETs in a high voltage bipolar technology for bonded oxide/SOI interface characterization;Bashir;IEEE Electron Device Letters,1998
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Infrared Photodetectors and Image Arrays Made with Organic Semiconductors;Chinese Journal of Polymer Science;2023-04-18
2. Visible-to-near-infrared organic photodiodes with performance comparable to commercial silicon-based detectors;Applied Physics Letters;2020-08-31
3. Analysis of breakdown voltage of area surrounded by multiple trench gaps in 4 kV monolithic isolator for communication network interface;Japanese Journal of Applied Physics;2015-02-27
4. Process optimization of a deep trench isolation structure for high voltage SOI devices;Journal of Semiconductors;2010-12
5. Deep Trench Refilling With Parylene C for High-Quality Isolation in Bulk Micromachined Devices;2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems;2008-01-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3