Pixel readout chips in deep submicron CMOS for ALICE and LHCb tolerant to 10Mrad and beyond-Reference-Cited by-同舟云学术

Pixel readout chips in deep submicron CMOS for ALICE and LHCb tolerant to 10Mrad and beyond

Published:2001-07 Issue:2 Volume:466 Page:366-375
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Snoeys W.,Burns M.,Campbell M.,Cantatore E.,Cencelli V.,Dinapoli R.,Heijne E.,Jarron P.,Lamanna P.,Minervini D.,Morel M.,O’Shea V.,Quiquempoix V.,Bello D.San Segundo,Van Koningsveld B.,Wyllie K.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference28 articles.

1. ALICE—Technical Proposal for A Large Ion Collider Experiment at the CERN LHC, CERN/LHCC 95-71, December 1995.

2. ALICE—Technical Design Report of the Inner Tracking System (ITS), CERN/LHCC 99-12, June 1999.

3. LHCb Technical Proposal, CERN/LHCC 98-4, February 1998.

4. Radiation Effects in MOS Capacitors with Very Thin Oxides at 80degK

5. Generation of Interface States by Ionizing Radiation in Very Thin MOS Oxides

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