The attachment of thin alumina ceramic plates to Kovar® using gold germanium solder-Reference-Cited by-同舟云学术

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The attachment of thin alumina ceramic plates to Kovar® using gold germanium solder

Published:1998-03 Issue:1 Volume:5 Page:69-75
ISSN:1350-6307
Container-title:Engineering Failure Analysis
language:en
Short-container-title:Engineering Failure Analysis

Author:

Matsuoka D.,Smith M.,Es-Said O.S.

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference3 articles.

1. Principles of Soldering and Brazing;Humpston,1993

2. Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy

3. Substrate Soldering in Microwave Hybrid Integrated Circuit Assembly;Winkle,1990

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical behavior of ceramic-metal joint under quasi-static and dynamic four point bending: Microstructures, damage and mechanisms;Ceramics International;2017-06

2. The use of artificial neural network (ANN) for modeling the useful life of the failure assessment in blades of steam turbines;Engineering Failure Analysis;2013-12

3. Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar;Journal of Materials Science: Materials in Electronics;2010-03-19

4. Investigation of interfacial reaction between Au–Sn solder and Kovar for hermetic sealing application;Microelectronic Engineering;2007-11

5. Active brazing of pure alumina to Kovar alloy based on the partial transient liquid phase (PTLP) technique with Ni–Ti interlayer;Journal of the European Ceramic Society;2002-12

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