Preparation, microstructure and properties of three-dimensional carbon/carbon composites withhigh thermal conductivity
Author:
Publisher
Elsevier BV
Subject
General Materials Science,Materials Science (miscellaneous)
Reference29 articles.
1. Japanese development of fusion reaction plas-ma components[J];Hino;Fusion Engineering and Design,2000
2. Thermophysical properties of densified pitch based carbon/carbon materials—I. Unidirectional composites[J];Manocha;Carbon,2006
3. Oxidation behavior of three-dimensional woven C/SiC composites[J];Yin;Materials Science & Technology,2013
4. Tribological properties of carbon/carbon composites with various pyrolytic carbon microstructures[J];Yu;Wear,2013
5. Effect of C/C preform density on microstructure and mechanical properties of C/C-SiC composites prepared by alloyed reactive melt infiltration[J];Tong;Materials Science & Technology,2013
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