Intermetallic phases influencing the behaviour of Al-Cu joints
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Reference14 articles.
1. Bonding at Cu-Al interfaces: Relevance to microcircuit packaging
2. Fundamentals of Solid-Phase Welding
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4. Growth of intermetallic phases in Al/Cu composites at various annealing temperatures during the ARB process;Metals and Materials International;2012-02
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