Yield stress measurements and microstructure of colloidal kaolin powders clusterized and dispersed in different liquids
Author:
Publisher
Elsevier BV
Subject
General Chemical Engineering,General Materials Science
Reference28 articles.
1. Surfactant-promoted formation of fractal and dendritic nanostructures of gold and silver at the organic–aqueous interface;Agrawal;Journal of Colloid and Interface Science,2008
2. An introduction to rheology;Barnes,1989
3. A handbook of elementary rheology;Barnes,2000
4. Aluminum hydroxide microstructural units in gelled media aged, or nonaged, with alcohol and water;Beruto;Journal of Colloid and Interface Science,2008
5. Effect of vacuum and of strong adsorbed water films on micropore formation in aluminum hydroxide xerogel powders;Beruto;Journal of Colloid and Interface Science,2009
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