Fatigue performance of fused filament fabrication PLA specimens
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference39 articles.
1. Finite element analysis of the thermal behavior of a RepRap 3D printer liquefier;Jerez-Mesa;Mechatronics,2016
2. A comparative study of the thermal behavior of three different 3D printer liquefiers;Jerez-Mesa;Mechatronics,2017
3. Modeling of bond formation between polymer filaments in the fused deposition modeling process;Bellehumeur;J. Manuf. Process.,2004
4. Mechanical property characterization and simulation of fused deposition modeling polycarbonate parts;Domingo-Espin;Mater. Des.,2015
5. Effect of processing conditions on the bonding quality of FDM polymer filaments;Sun;Rapid Prototyp. J.,2008
Cited by 181 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigating the tensile properties and crystallinity of 3D-printed poly (ether ether ketone)/poly (ether imide) [PEEK/PEI] blend in the Z-direction by fused filament fabrication;Progress in Additive Manufacturing;2024-08-29
2. Design methodology for fused filament fabrication with failure theory: framework, database, design rule, methodology and study of case;Rapid Prototyping Journal;2024-08-27
3. The fatigue responses of 3D‐printed polylactic acid (PLA) parts with varying raster angles and printing speeds;Fatigue & Fracture of Engineering Materials & Structures;2024-08
4. Low-cycle compression-compression fatigue behavior of MEX-printed PLA parts;Engineering Failure Analysis;2024-07
5. A Review of Additive Manufacturing in Tissue Engineering and Regenerative Medicine;Biomedical Materials & Devices;2024-06-20
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3