Binder jetting additive manufacturing with a particle-free metal ink as a binder precursor

Author:

Bai YunORCID,Williams Christopher B.ORCID

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference32 articles.

1. Roadmap for Additive Manufacturing: Identifying the Future of Freeform Processing;Bourell,2009

2. The status, challenges, and future of additive manufacturing in engineering;Gao;Comput. Des.,2015

3. An exploration of binder jetting of copper;Bai;Rapid Prototyp. J.,2015

4. Development process for custom three-dimensional printing (3DP) material systems;Utela;J. Manuf. Sci. Eng.,2010

5. Materials development for ProMetal;Jianxin;Mater. Sci. Technol.,2006

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