Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications-Reference-Cited by-同舟云学术

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Published:2009-12 Issue:10 Volume:30 Page:4502-4506
ISSN:0261-3069
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Mallik S.,Ekere N.N.,Durairaj R.,Marks A.E.,Seman A.

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference14 articles.

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2. Solder paste rheology and fine pitch slump;Anderson;J SMT,1995

3. Rheological characterisation of solder paste for surface mount applications;Kolli;IEEE Trans Components, Packaging and Manufact Technol, Part B,1997

4. Engineering solder paste performance through controlled stress rheology analysis;Bao;J Soldering Surf Mount Technol,1998

5. Nguty TA, Ekere NN, Adebayo A. Correlating solder paste composition with stencil printing performance. In: IEEE/CPMT international electronics manufacturing technology symposium, Austin (TX); 1999. p. 304–9.

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