Effects of thickness specimen on the evaluation of relationship between tensile properties and small punch testing parameters in metallic materials
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. Improved small punch testing and parameter identification of ductile to brittle materials;Rasche;Int. J. Press. Vessel. Pip.,2015
2. Creep behaviors evaluation of Incoloy800H by small punch creep test;Yang;Mater. Sci. Eng. A,2017
3. The significance of specimen displacement definition on the mechanical properties derived from Small Punch Test;Moreno;Mater. Des.,2016
4. Estimation of the mechanical properties of metallic materials by means of the small punch test;García;J. Alloys Compd.,2014
5. Deformation mechanisms of IN713C nickel based superalloy during Small Punch Testing;Coleman;Mater. Sci. Eng. A,2016
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