Wear behaviour of electroless Ni–P coatings and optimization of process parameters using Taguchi method
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference22 articles.
1. Brenner A, Riddell GE. Nickel plating by chemical reduction. US Patent: US2532282; 1950.
2. Electroless nickel plating;Riedel,1991
3. The structure of electroless Ni–P films as a function of composition;Allen;Scripta Metall,1982
4. Properties of electrodeposited Ni–P–SiC composite coatings;Berkh;Metal Finish,1996
5. Electroless plating processes: developing technologies for electroless nickel, palladium, and gold;Baudrand;Metal Finish,1995
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