Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method-Reference-Cited by-同舟云学术

Influence of intermetallic compounds on the electrical resistivity of architectured copper clad aluminum composites elaborated by a restacking drawing method

Published:2018-10 Issue: Volume:155 Page:366-374
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Moisy F.,Gueydan A.,Sauvage X.,Guillet A.,Keller C.,Guilmeau E.,Hug E.

Funder

Institut Carnot ESP

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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