Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints-Reference-Cited by-同舟云学术

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Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints

Published:2015-05 Issue: Volume:73 Page:42-49
ISSN:0261-3069
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Xiao Yong,Li Mingyu,Wang Ling,Huang Shangyu,Du Xueming,Liu Zhiquan

Funder

National Nature Science Foundation of China

Shenzhen Science and Technology Plan Project

Publisher

Elsevier BV

Subject

Applied Mathematics,General Mathematics

Reference26 articles.

1. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001

2. A thermodynamic study of phase equilibria in the Au–Sb–Sn solder system;kim;J. Electron. Mater.,2002

3. Interfacial reaction between Cu substrates and Zn–Al base high-temperature Pb-free solders;Takaku;J. Electron. Mater.,2008

4. Effect of Ag addition to Zn–12Al alloy on kinetics of growth of intermediate phases on Cu substrate;Gancarz;J. Alloys Comp.,2014

5. Microstructure and creep characteristics of Zn–3Cu–xAl ultra high temperature lead free solders;Alibabaie;Mater. Des.,2012

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1. Acoustic cavitation-induced microstructure evolution in ultrasonically brazed Al/Cu joints using Zn-Al alloy fillers;Ultrasonics Sonochemistry;2024-10

2. Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate;Applied Sciences;2024-02-13

3. Microstructural transformation and mechanical properties of Cu-sputtered alumina ceramic/Zn5Al/AA2024 ultrasonic soldering joints;Intermetallics;2024-02

4. Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple;Soldering & Surface Mount Technology;2023-09-19

5. Mechanism of oxide film removal and analysis of diffusion behavior of interfacial elements during magnetic pulse-assisted semi-solid brazing;Journal of Materials Processing Technology;2023-09

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