Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys-Reference-Cited by-同舟云学术

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Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys

Published:2019-11 Issue: Volume:182 Page:108039
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Liao Xinjiang,Mu Dekui^ORCID,Fu Wei^ORCID,Huang Hui,Huang Han

Funder

Huaqiao University

National Natural Science Foundation of China

Department of Science and Technology of Fujian Province

Changjiang Scholars and Innovative Research Team in University

Australian Research Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference54 articles.

1. Metal matrix composites for thermal management: a review;Sidhu;Critical Reviews in Solid State and Materials Sciences,2016

2. Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications;Ciupiński;Mater. Des.,2017

3. Interfacial characteristic and thermal conductivity of Al/diamond composites produced by gas pressure infiltration in a nitrogen atmosphere;Li;Mater. Des.,2016

4. Recent advances in diamond power semiconductor devices;Umezawa;Mater. Sci. Semicond. Process.,2018

5. Study on design and performance of metal-bonded diamond grinding wheels fabricated by selective laser melting (SLM);Tian;Mater. Des.,2018

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2. RESEARCH PROGRESS OF HIGH PERFORMANCE COATINGS PREPARED BY TUNGSTEN INERT GAS (TIG) CLADDING ON TYPICAL METALLIC MATERIALS: A MINI REVIEW;Surface Review and Letters;2024-06-28

3. Brazing of diamond to invar with Ag-Cu-Ti filler alloy: Wettability, microstructure and mechanical performance;Diamond and Related Materials;2024-05

4. Adhesive and tensile properties of diamond(001)/TiC(111) interfaces: A first-principles investigation;International Journal of Refractory Metals and Hard Materials;2023-12

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