Subject
Applied Mathematics,General Mathematics
Reference27 articles.
1. Guosheng J, Kuang K, Zhu D. High performance microelectronics packaging heat sink materials, In: Kuang K, et al. editors. RF and Microwave Microelectronics Packaging, 2010. p. 233–265.
2. Thermal materials solve power electronics challenges;Zweben;Power Electron Technol,2006
3. Investigation of interface layer failure and shear strength of CMT brazed lap joints in dissimilar materials;Lin;Transac JWRI,2011
4. Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler;Tsao;Mater Sci Eng A,2013
5. Active soldering of indium tin oxide (ITO)with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler;Chang;JMEPEG,2003
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27 articles.
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