Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer
Author:
Funder
National Natural Science Foundation of China
Natural Science Foundation of Shandong Province
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference55 articles.
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4. Diffusion bonding of Ti/Ni under the influence of an electric current: mechanism and bond structure;Gao;J. Mater. Sci.,2017
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