Microstructure and mechanical strength of near- and sub-micrometre grain size copper prepared by spark plasma sintering-Reference-Cited by-同舟云学术

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Microstructure and mechanical strength of near- and sub-micrometre grain size copper prepared by spark plasma sintering

Published:2017-03 Issue: Volume:117 Page:95-103
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Zhu K.N.,Godfrey A.,Hansen N.,Zhang X.D.

Funder

Danish National Research Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference39 articles.

1. Strength and ductility of ultrafine grained aluminum and iron produced by ARB and annealing;Tsuji;Scr. Mater.,2002

2. Strengthening mechanisms in nanostructured high-purity aluminium deformed to high strain and annealed;Kamikawa;Acta Mater.,2009

3. Transition of tensile deformation behaviors in ultrafine-grained aluminum;Yu;Acta Mater.,2005

4. Inhomogeneous tensile deformation in ultrafine-grained aluminum;Hung;Scr. Mater.,2005

5. Hardening by annealing and softening by deformation in nanostructured metals;Huang;Science,2006

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