Thermal and electrical properties of W–Cu composite produced by activated sintering
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,General Mathematics
Reference25 articles.
1. Liu J, Wang T, Carlberg B, Inoue M. Recent progress of thermal interface materials. In: Second electronics system integration technology conference, 2008.
2. Fabrication of W–Cu functionally graded materials with high density by particle size adjustment and solid state hot press;Liu;Compos Sci Technol,2008
3. Preparation and characterization of W–Cu nanopowders by a homogeneous precipitation process;Cheng;J Alloys Compd,2006
4. Chemical synthesis and sintering behavior of highly dispersed W/Cu composite powders;Gusmano;J Mater Sci,2001
5. Densification behavior of mechanically alloyed W–Cu composite powders by the double rearrangement process;Kim;Scripta Mater,1998
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