Enhanced tough recyclable hemiaminal dynamic covalent network with boron nitride composites material with high thermal conductivity at low filler content-Reference-Cited by-同舟云学术

Enhanced tough recyclable hemiaminal dynamic covalent network with boron nitride composites material with high thermal conductivity at low filler content

Published:2024-04 Issue: Volume:448 Page:141657
ISSN:0959-6526
Container-title:Journal of Cleaner Production
language:en
Short-container-title:Journal of Cleaner Production

Author:

Huang Caiyue,Jia Xiaohua^ORCID,Tian Rui,Yang Jin,Song Haojie

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

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5. Construction and mechanism of 3D printed polyamide 12/boron nitride template composites with localized and unidirectional thermally conductive property;Chen;Compos. Part B Eng.,2021

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