New bending mode in SAQP Si fins and its mitigation

Author:

Sepulveda Alfonso,Hellin David,Zhang Liping,Kenis KarineORCID,Batuk Dmitry,Baudot Sylvain,Briggs Basoene,Sanchez Efrain Altamirano,Mountsier Tom,Barla Kathy,Morin Pierre

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference21 articles.

1. International roadmap for devices and systems 2017 edition more moore;IEEE Adv. Technol. Humanit.,2016

2. Epitaxial diamond-hexagonal silicon nano-ribbon growth on;Qiu;Nat. Publ. Gr.,2015

3. S. Atd, “Fin Bending Mechanism Investigation for 14nm Finfet,” pp. 2–4.

4. Fin Bending Due D to Stress and its Sim Mulation;Gencer,2013

5. Fin bending mitigation and local layout effect alleviation in advanced FinFET technology through material engineering and metrology optimization;Wen;Dig. Tech. Pap. - Symp. VLSI Technol.,2019

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