Effect of radial grooves pads on copper chemical mechanical polishing
Author:
Funder
Ministry of Trade, Industry and Energy
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
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4. Advances in characterization of CMP consumables;Moinpour;MRS Bull.,2002
5. Material removal mechanism in chemical mechanical polishing: theory and modeling;Luo;IEEE Trans. Semicond. Manuf.,2001
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1. Research on the shear thickening polishing CaF2 with textured hollow polishing tool;Journal of Manufacturing Processes;2024-06
2. INVESTIGATION OF THERMAL MANAGEMENT DURING CHEMICAL MECHANICAL POLISHING PROCESS;Proceeding of International Heat Transfer Conference 17;2023
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