Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists-Reference-Cited by-同舟云学术

Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists

Published:2018-12 Issue: Volume:88 Page:132-138
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Chen Meng-Hsin,Lai Chiu-Chun,Chen Hsin-Lung,Lin Yi-Hung,Huang Kuan-Yeh,Lin Chih-Hsiang,Hsiao Ho-Ting,Liu Lung-Chang,Chen Chien-Ming

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference32 articles.

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