Development of Highly stable ceria slurry in acetic acid-ammonium acetate buffer Media for effective chemical mechanical polishing of silicon dioxide-Reference-Cited by-同舟云学术

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Development of Highly stable ceria slurry in acetic acid-ammonium acetate buffer Media for effective chemical mechanical polishing of silicon dioxide

Published:2024-07 Issue: Volume:177 Page:108411
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Liu Min,Zhang Baoguo^ORCID,Seo Jihoon,Xian Wenhao,Cui Dexing,Liu Shitong,Wang Yijun,Qin Sihui,Liu Yang

Publisher

Elsevier BV

Reference44 articles.

1. Chemical mechanical planarization for microelectronics applications;Zantye;Mater. Sci. Eng. R Rep.,2004

2. Cleaning solutions for removal of ∼30 nm ceria particles from proline and citric acid containing slurries deposited on silicon dioxide and silicon nitride surfaces;Gowda;ECS J. Solid State Sci. Technol.,2020

3. Role of slurry additives on chemical mechanical planarization of silicon dioxide film in colloidal silica based slurry;Li;ECS J. Solid State Sci. Technol.,2021

4. Mechanism of Co liner as enhancement layer for Cu interconnect gap-fill;He;J. Electrochem. Soc.,2013

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1. Enhancing dispersion stability and recyclability of ceria slurry with polyacrylic acid for improved glass polishing performance;Journal of Industrial and Engineering Chemistry;2024-10

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