Investigation of silicon-based light emitting diode sub-mounts: Enhanced performance and potential for improved reliability-Reference-Cited by-同舟云学术

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Investigation of silicon-based light emitting diode sub-mounts: Enhanced performance and potential for improved reliability

Published:2015-03 Issue: Volume:31 Page:604-610
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Tseng Shih-Chieh,Tang Chao-Wei,Liao Hsueh-Chuan,Li Kuan-Ming,Young Hong-Tsu

Funder

National Science Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference17 articles.

1. Life of LED-Based White Light Sources

2. An electrical model with junction temperature for light-emitting diodes and the impact on conversion efficiency

3. D. Pinjala, M.K. Iyer, S.G. Chow, I.J. Rasiah, in: Electron. Packag. Technol. Conf., 2000, pp. 144–147.

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3. Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis;Microelectronics International;2018-01-02

4. Thermal characteristics and fabrication of silicon sub-mount based LED package;Microelectronics Reliability;2016-01

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