Author:
Yoshimura Tetsuzo,Takeda Daisuke,Sato Takuya,Kinugasa Yoshihiko,Nawata Hideyuki
Funder
Ministry of Education, Culture, Sports, Science and Technology
Subject
Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Multiscale optical design for global chip-to-chip optical interconnections and misalignment tolerant packaging
2. Implementation of active interposer for high-speed and low-cost chip level optical interconnects
3. Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnects
4. F.E. Doany, C.L. Schow, B.G. Lee, R. Budd, C. Baks, R. Dangel, R. John, F. Libsch, J.A. Kash, B. Chan, H. Lin, C. Carver, J. Huang, J. Berry, D. Bajkowski, Proceedings of 61st Electronic Components & Technology Conference (ECTC), 2011, p. 790.
5. D.A.B. Miller, Workshop Notes, 8th Annual Workshop on Interconnections Within High Speed Digital Systems, Lecture 1.2, 1997.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献