Role of temperature and preexisting dislocation network on the shock compression of copper crystals
Author:
Funder
Russian Science Foundation
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference55 articles.
1. Atomistic survey of grain boundary-dislocation interactions in FCC nickel;Adams;Comput. Mater. Sci.,2019
2. Elastic precursor wave decay in shock-compressed aluminum over a wide range of temperature;Austin;J. Appl. Phys.,2018
3. A dislocation-based constitutive model for viscoplastic deformation of fcc metals at very high strain rates;Austin;Int. J. Plast.,2011
4. Dislocation drag and its influence on elastic precursor decay;Blaschke;Int. J. Plast.,2021
5. Atomistic shock hugoniot simulation of single-crystal copper;Bringa;J. Appl. Phys.,2004
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Atomistic insight into laser shock peening response of α-titanium: an experimentally verified simulation study;Acta Materialia;2024-09
2. Role of solid solution strengthening on shock wave compression of [111] copper crystals;Journal of Applied Physics;2024-06-14
3. High-temperature heat treatment attenuating the influence of micron-sized inclusions on the microstructure and properties of recycled Al-Zn-Mg-Cu alloy sheet;Journal of Materials Research and Technology;2024-05
4. Examination of machine learning method for identification of material model parameters;International Journal of Mechanical Sciences;2024-03
5. Dynamic tensile fracture of iron: Molecular dynamics simulations and micromechanical model based on dislocation plasticity;International Journal of Plasticity;2023-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3