Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
Author:
Funder
Ministry of Higher Education, Malaysia
Publisher
Elsevier BV
Subject
Applied Mathematics,Modelling and Simulation
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1. Formulation for Multiple Cracks Problem in Thermoelectric-Bonded Materials Using Hypersingular Integral Equations;Mathematics;2023-07-24
2. Approximate structures of thermoelastic fields induced by a penny-shaped thermal-medium crack in a transversely isotropic layer;Applied Mathematical Modelling;2022-07
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