Low temperature Cu joining by in situ reduction-sintering of CuO nanoparticle for high power electronics
Author:
Funder
China Scholarship Council
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Chemical Engineering
Reference27 articles.
1. Low temperature sintering Cu6Sn5 nanoparticles for superplastic and super-uniform high temperature circuit interconnections;Zhong;Small,2015
2. Influence of nanoparticles content in silver paste on mechanical and electrical properties of LTJT joints;Kiełbasiński;Adv. Powder Technol.,2015
3. NanoCopper based solder-free electronic assembly;Zinn;Nanotech,2012
4. Influence of joining conditions on bonding strength of joints: efficacy of low-temperature bonding using Cu nanoparticle paste;Yamakawa;J. Electron. Mater.,2013
5. Joining of Pure Copper Using Cu Nanoparticles Derived from CuO Paste;Fujimoto;Mater. Trans.,2015
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