Surface characteristic driven in waste printed circuit boards flotation: Floatability mechanism of resin and glass fiber in non-metallic component-Reference-Cited by-同舟云学术

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Surface characteristic driven in waste printed circuit boards flotation: Floatability mechanism of resin and glass fiber in non-metallic component

Published:2023-10 Issue: Volume:178 Page:360-369
ISSN:0957-5820
Container-title:Process Safety and Environmental Protection
language:en
Short-container-title:Process Safety and Environmental Protection

Author:

Nie Chun-chen,Jiang Si-qi,Li Xi-guang,Lyu Xian-jun,Zhang Ya-qing,Zhu Xiang-nan

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Safety, Risk, Reliability and Quality,General Chemical Engineering,Environmental Chemistry,Environmental Engineering

Reference46 articles.

1. Oxidative and pyrolytic decomposition of an evaporated stream of 2,4,6-tribromophenol over hematite: a prevailing scenario during thermal recycling of e-waste;Ali;Waste Manag.,2022

2. Investigating critical parameters for bioremoval of heavy metals from computer printed circuit boards using the fungus Aspergillus niger;Arshadi;Hydrometallurgy,2020

3. Synthesis of Ag nanoparticles from waste printed circuit board;Caldas;J. Environ. Chem. Eng.,2021

4. Separation of plastics: the importance of kinetics knowledge in the evaluation of froth flotation;Censori;Waste Manag.,2016

5. Improving bromine fixation in co-pyrolysis of non-metallic fractions of waste printed circuit boards with Bayer red mud;Chen;Sci. Total Environ.,2018

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of surface roughness on hydrophobicity of magnesite and bubble-particle adhesion;Minerals Engineering;2024-09

2. Sustainable recovery and recycling of scrap copper and alloy resources: A review;Sustainable Materials and Technologies;2024-09

3. A comprehensive review of the mechanical separation of waste printed circuit boards;Process Safety and Environmental Protection;2024-07

4. Advanced Recovery Strategies for Metallic and Nonmetallic Fractions from Waste Printed Circuit Boards: A Comprehensive Review;Separation & Purification Reviews;2024-05-29

5. Property Enhancement of Waste Printed Circuit Boards Powders Reinforced Polypropylene by In Situ Magnesium Hydroxide Impregnation from Waste Lye;Polymers;2024-03-15

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