Contribution to the study of copper electrocrystallization in view of industrial applications — submicroscopic and macroscopic considerations
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference24 articles.
1. E. Budevski, G. Staikov and W. J. Lorenz, Electrochemical Phase Formation and Growth. VCH Weinheim, 1996
2. Electrocrystallization — theory and applications;Winand;Hydrometallurgy,1992
3. Electrodeposition of metals and alloys — new results and perspectives;Winand;Electrochim. Acta,1904
4. Nucleation and initial growth of copper electrodeposits under galvanostatic conditions;Vanden Brande;Surf. Coatings Technol.,1992
5. First stages of the formation of copper electrodeposits and copper sputtered deposits on amorphous carbon and polycrystalline silver substrates;Vanden Brande;J. Appl. Electrochem.,1993
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Smoothing Enhancement of Sodium 4-Hydroxyphenylsulfonate on Cathode Copper from Simulated Leachate of Copper–Cadmium Slag by Cyclone Electrowinning;Journal of Sustainable Metallurgy;2023-11-07
2. Nodule Formation on Copper Electrodeposits in the Rotating Cylinder Hull Cell;Metallurgical and Materials Transactions B;2022-01-07
3. Effects of Thiourea and Allyl Thioura on the Electrodeposition and Microstructures of Copper from Methanesulfonic Acid Baths;Journal of The Electrochemical Society;2021-03-01
4. Effect of zinc ions on copper electrodeposition in the context of metal recovery from waste printed circuit boards;Hydrometallurgy;2020-12
5. Effect of Magnetic Field on Electrodeposition of Nanosize Structures;METALLOFIZIKA I NOVEISHIE TEKHNOLOGII;2018-09-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3