Potential scan rate dependence of underpotential and bulk depositions of lead on screen-printed silver electrodes
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference25 articles.
1. Elimination of intermetallic compound interferences in twin-electrode thin-layer anodic stripping voltammetry
2. The third element effect in anodic stripping voltammetry
3. Determination of lead(II) on a copper/mercury-plated screen-printed electrode
4. Underpotential Deposition at Single Crystal Surfaces of Au, Pt, Ag and Other Materials
5. Monte Carlo simulation of underpotential deposition in the system
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