Initial propagation stage of direct copper plating on non-conducting substrates
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference10 articles.
1. Direct Electroplating on Nonconductors
2. A Palladium Sulfide Catalyst for Electrolytic Plating
3. A Search for the Mechanism of Direct Copper Plating via Bridging Ligands
4. Analysis of Direct Copper Plating Acceleration by Pd/Sn Mixed Catalyst.
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. An attempt for morphology‐based quantitative prediction of adhesion strength between metal‐polymer interface;Journal of Applied Polymer Science;2023-10-18
2. Surface modification of ABS polymer by electroless deposition of thin nickel film from a solution without reducing agent;Transactions of the IMF;2023-03-31
3. Anodizing—Pursuing the Wonder of Anodic Oxidation—;Denki Kagaku;2022-12-05
4. Copper Coated Electrode by Fused Deposition Modelling (FDM) Process;Proceedings of the 2nd Energy Security and Chemical Engineering Congress;2022-09-22
5. Rheological approach to the adhesion property of metal‐plated acrylonitrile‐butadiene‐styrene to secure the driver's safety;Journal of Applied Polymer Science;2021-10-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3