Finite element analysis of the foot: Stress and displacement shielding
Author:
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine
Reference20 articles.
1. Optical pedobarography for assessing neuropathic feet in diabetic patients—a review;Patil;Int J Low Extrem Wounds,2002
2. Effect of customized insoles on vertical plantar pressures in sites of previous neuropathic ulceration in the diabetic foot;Raspovic;Foot,2000
3. A study of in-shoe plantar shear in patients with diabetic neuropathy;Lord;Clin BioMech,2000
4. Stress distribution of the foot duringmid-stance to push-off in barefoot gait: a 3-D finite element analysis;Chen;Clin BioMech,2001
5. Plantar soft tissue loading under the medial metatarsals in the standing diabetic foot;Gefen;Med Eng Phys,2003
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Designing Plantar Ortheses via FEM: Model Generation and Multimaterial Insole Testing;2024 5th International Conference in Electronic Engineering, Information Technology & Education (EEITE);2024-05-29
2. Finite element modeling of diabetic foot: a state-of-the-art review;Engineering Research Express;2024-03-01
3. Clinically useful finite element models of the natural ankle – A review;Clinical Biomechanics;2023-06
4. Percutaneous balloon calcaneoplasty versus open reduction and internal fixation (ORIF) for intraarticular SANDERS 2B calcaneal fracture: Comparison of primary stability using a finite element method;Injury;2023-06
5. The Effect of Mechanical Properties of the Capsular-Connected Complex Acetabulum Pedis on Movements in the Two-Segment Foot Model in Normal Foot and Flatfoot;Herald of Orthopaedics, Traumatology and Prosthetics;2023-04-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3